Thermal management is of greater importance than ever and increasingly challenging, as a number of driving factors are dictating the need for better thermal management: 

• PCs and consumer electronics in general are becoming smaller and smaller, leaving no room for existing bulky cooling solutions. 

• Device and component heat flux and hotspots with smaller cores raise and exceed the limits of traditional heat sinks and heat pipes.

• Multiple cores per CPU system increase the need for more efficient heat transfer.

• Graphics chips are becoming more power hungry and call for even better power dissipation.

• PCs and consumer electronics in general are merging and becoming common living room devices, and therefore acoustics is becoming a key end-user concern and selection factor that present thermal solutions do not address sufficiently. It is important to point out that end users are willing to pay more for low noise! Several OEMs still need to accept that low acoustic noise emission is a competitive advantage and not just an added cost.

To increase performance

multi cores and dual

CPUs in PCs and

servers are the new

paradigm

A total power

consumption

above 130 Watt

is not unrealistic