Monem Alyaser, VP Business Development at Asetek was invited to present on “Liquid Cooling Viability for Mainstream Microelectronics Thermal Management” at the IMAPS Advanced Technology Workshop on Thermal Management held September 24th - 27th 2007 in San Jose, CA, USA. 

Questions are still being raised about liquid cooling and its viability for mainstream microelectronics thermal management. Considering all of the recent advances in chip technology and air cooled heat pipe-heat sink assemblies, these questions include the following: (1) Are there real thermal management barriers for the development of next generation products that cannot be overcome with air cooled heat sinks? (2) What are the advantages of liquid cooling? (3) What are the characteristics that make a liquid cooling system viable for the mainstream market? (4) What is the current and future market size for liquid cooling? Aiming to answer these questions, this presentation discusses the technical and market drivers for liquid cooling adoption. This presentation further argues the case that liquid cooling is now a viable mainstream solution by exploring the key characteristics of a state-of-the-art liquid cooling solution. 

To get a copy of the final presentation click here