RackCDU™ D2C™ Liquid Cooling
Hot Water Liquid Cooling for Data Centers.
RackCDU™ with D2C™ (Direct-to-Chip) Liquid Cooling is a hot water, direct-to-chip, data center liquid cooling system that enables cooling energy savings exceeding 50% and density increases of 5x when compared to modern air cooled data centers. D2C removes heat from CPUs, GPUs, memory modules and other hot spots within servers and takes it all the way out of the data center using liquid.
Free ambient outdoor air cools the water returning to the data center, meaning no power is used to actively chill the water. The water leaving the data center is hot enough to enable waste heat recycling, further increasing energy cost savings, reducing carbon footprint and resulting in cooling EREs (Energy Reuse Efficiencies) below 1! Although RackCDU with D2C removes most of the server heat, the data center will still depend on a certain airflow to remove the remaining server heat.
RackCDU is deployed at a rack/server level providing maximum scalability. The system consists of a zero-U rack level CDU (Cooling Distribution Unit) mounted in a 10.5 inch rack extension that includes space for 3 additional PDUs, and direct-to-chip cooling loops within each server. The direct-to-chip cooling loops are drop in replacements for the existing air heat sinks, with tubes exiting through an unused PCIe slot. This enables RackCDU deployment as a retrofit during server refresh cycles and in new builds.
- Cooling energy savings exceeding 50%.
- Rack level density increases of 2.5x to 5x.
- Server level density (higher TDP CPU/GPUs in smaller form factors).
- Waste Heat Recycling achieving ERE < 1.
- Immediate to 1 year payback cycles typical.
- Enables high temperature data centers.
- Full surveillance/alarm system monitoring temperatures, pressure, flow and leaks.