Flexible, Proven and Reliable Cooling for Data Centers

Density and interconnect optimization is key to obtaining the computational power needed for HPC and Artificial Intelligence. With applications emerging to solve a range of challenges, these systems can have a diverse set of requirements when considering thermal solutions.

Liquid Cooling Technology

HPC and AI workloads require high performance processors in dense configurations.

That’s why Asetek Direct-to-Chip (D2C) technology is cooling some of the world’s fastest supercomputers. 

The pervasive nature of AI applications means demand for these sophisticated cooling solutions is becoming more prevalent for enterprise customers.

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Liquid Cooling Technology

Flexible Platform

Implementation of liquid cooling at its best requires an architecture that can keep up with the highest rack power densities and can be adapted quickly to the latest server designs. Asetek offers a flexible, proven and reliable liquid cooling solutions for air-cooled and liquid-cooled data centers.

Proven Reliability

Asetek is the only liquid cooling solution validated and factory installed by Intel.

The Intel® Compute Modules for both Xeon® and Xeon® Phi™ CPUs, include:

  • Intel Compute Module HNS2600BP Family

Features Intel Xeon Scalable Processors with Asetek Direct-to-Chip (D2C) liquid-cooling

  • Intel Compute Module HNS7200APRL Family

Features Intel Xeon Phi Processors with Liquid to Air Assisted (LAAC) technology

 

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Proven Reliability

Proven Performance

Our Direct-to-Chip (D2C) liquid cooling technology is cooling some of the fastest supercomputers in the world.

In fact, our technology is cooling three of the installations in the TOP20, including the fastest supercomputers in Taiwan and Japan.

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Proven Performance

Industry Leading Data Center OEM Partners

Our liquid cooling solutions are powering many of the leading providers of HPC and AI solutions. Check out the list of premier data center OEM partners who’ve integrated Asetek technology into their offerings.

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