Asetek is the world leader and innovator in liquid cooling for data centers. Asetek provides high performance solutions for a diverse range of systems and challenges including High Performance Computing (HPC), Artificial Intelligence (AI) and Cloud services.
Liquid Cooling for Performance
HPC and AI workloads require high performance processors in dense configurations. That’s why Asetek Direct-to-Chip (D2C) technology is cooling some of the world’s fastest supercomputers. The pervasive nature of AI applications means demand for these sophisticated cooling solutions is becoming more prevalent for enterprise customers.
Learn more
Leading Innovation in Liquid Cooling
Asetek's commitment to innovate brings advances in performance and increased density for data centers. From high performance computing that secures entire countries, to artificial intelligence that is spawning an explosion of new applications for data center users … We’re innovating to increase density for maximum compute throughput in data centers.
Learn more
Energy Saving Technology
Asetek's patented technology can reduce the energy data centers use for cooling by up to 50%. This is done by cooling the processors directly instead of cooling the entire rack. In addition we can recoup the energy spent cooling and for example provide 60°C water for remote heating or turn the waste hot water into electricity.
Learn moreImplementation of liquid cooling at its best requires an architecture that can keep up with the highest rack power densities and can be adapted quickly to the latest server designs. Asetek offers flexible, proven and reliable liquid cooling solutions for liquid-cooled data centers.
The Asetek lnRackCDU is a genuinely low pressure, warm water CDU (Cooling Distribution Unit) system capable of removing up to 80kW of heat from the rack.
Direct to Chip (D2C) liquid cooling technology dramatically increases data center density and enables maximum sustained CPU throughput.
D2C liquid cooling provides a distributed cooling architecture to address the full range of heat rejection scenarios in air-cooled and liquid-cooled data centers.
InRackLAAC™ -- For Air-cooled Data Centers
The Asetek InRackLAAC system is capable of removing up to 6.4 kW of total processor power from liquid cooled servers.
InRackCDU™ -- For Liquid-cooled Data Centers
The Asetek lnRackCDU is a warm water CDU (Cooling Distribution Unit) system capable of removing up to 80kW of heat from the rack.
Learn more
OnRackCDU™ -- For Liquid-cooled Data Centers
The Asetek OnRackCDU is a warm water system capable of reducing data center cooling cost by >50% and allowing 2.5x-5x increases in data center server density.
Asetek is the only liquid cooling solution validated and factory installed by Intel.
The Intel® Compute Modules for both Xeon® and Xeon® Phi™ CPUs, include:
Features Intel Xeon Scalable Processors with Asetek Direct-to-Chip (D2C) liquid-cooling
Features Intel Xeon Phi Processors with Liquid to Air Assisted (LAAC) technology
Our Direct-to-Chip (D2C) liquid cooling technology is cooling some of the fastest supercomputers in the world.
In fact, our technology is cooling many of the installations in the TOP500, including the fastest supercomputers in Taiwan and Japan.
Data centers around the globe are being mandated to simultaneously increase energy efficiency, consolidate operations and reduce costs. Each year, data centers consume approximately two percent of global power consumption. Because liquid is 4,000 times better at storing and transferring heat than air, our solutions provide immediate and measurable benefits to large and small data centers alike.
Asetek's liquid cooling technology provides an energy efficient alternative to air-cooled data centers.
Liquid cooling technology from Asetek can reuse 75% of the total energy used in data centers as 60°C hot water.
Cooled by Asetek. Our liquid cooling solutions are powering many of the leading providers of HPC and AI solutions. Check out the list of premier data center OEM partners who’ve integrated Asetek technology into their offerings.
