Asetek is the world leader & innovator in liquid cooling for data centers. Asetek provides flexible and reliable solutions for a diverse range of systems & challenges including HPC (High Performance Computing), AI (Artificial Intelligence) and Cloud services.
Data centers around the globe are being mandated to simultaneously increase energy efficiency, consolidate operations and reduce costs. Each year, data centers consume approximately two percent of global power consumption. Because liquid is 4,000 times better at storing and transferring heat than air, our solutions provide immediate and measurable benefits to large and small data centers alike.
Energy Saving Technology
Asetek's patented technology can reduce the energy data centers use for cooling by up to 50%. This is done by cooling the processors directly instead of cooling the entire rack. In addition we can recoup the energy spent cooling and for example provide 60°C water for remote heating or turn the waste hot water into electricity.
Liquid Cooling for Performance
HPC and AI workloads require high performance processors in dense configurations. That’s why Asetek Direct-to-Chip (D2C) technology is cooling some of the world’s fastest supercomputers. The pervasive nature of AI applications means demand for these sophisticated cooling solutions is becoming more prevalent for enterprise customers.
Leading Innovation in Liquid Cooling
Asetek's commitment to innovate brings advances in performance and increased density for data centers. From high performance computing that secures entire countries, to artificial intelligence that is spawning an explosion of new applications for data center users … We’re innovating to increase density for maximum compute throughput in data centers.
Implementation of liquid cooling at its best requires an architecture that can keep up with the highest rack power densities and can be adapted quickly to the latest server designs. Asetek offers a flexible, proven and reliable liquid cooling solutions for air-cooled and liquid-cooled data centers.
InRackLAAC™ -- For Air-cooled Data Centers
The Asetek InRackLAAC system is capable of removing up to 6.4 kW of total processor power from liquid cooled servers.
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InRackCDU™ -- For Liquid-cooled Data Centers
The Asetek lnRackCDU is a warm water CDU (Cooling Distribution Unit) system capable of removing up to 80kW of heat from the rack.
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OnRackCDU™ -- For Liquid-cooled Data Centers
The Asetek OnRackCDU is a warm water system capable of reducing data center cooling cost by >50% and allowing 2.5x-5x increases in data center server density.
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Asetek is the only liquid cooling solution validated and factory installed by Intel.
The Intel® Compute Modules for both Xeon® and Xeon® Phi™ CPUs, include:
Features Intel Xeon Scalable Processors with Asetek Direct-to-Chip (D2C) liquid-cooling
Features Intel Xeon Phi Processors with Liquid to Air Assisted (LAAC) technology
Our Direct-to-Chip (D2C) liquid cooling technology is cooling some of the fastest supercomputers in the world.
In fact, our technology is cooling three of the installations in the TOP20, including the fastest supercomputers in Taiwan and Japan.
Our liquid cooling solutions are powering many of the leading providers of HPC and AI solutions. Check out the list of premier data center OEM partners who’ve integrated Asetek technology into their offerings.
