Density and interconnect optimization is key to obtaining the computational power needed for HPC and Artificial Intelligence. With applications emerging to solve a range of challenges, these systems can have a diverse set of requirements when considering thermal solutions.
HPC and AI workloads require high performance processors in dense configurations.
That’s why Asetek Direct-to-Chip (D2C) technology is cooling some of the world’s fastest supercomputers.
The pervasive nature of AI applications means demand for these sophisticated cooling solutions is becoming more prevalent for enterprise customers.
Implementation of liquid cooling at its best requires an architecture that can keep up with the highest rack power densities and can be adapted quickly to the latest server designs. Asetek offers a flexible, proven and reliable liquid cooling solutions for air-cooled and liquid-cooled data centers.
InRackLAAC™ -- For Air-cooled Data Centers
The Asetek InRackLAAC system is capable of removing up to 6.4 kW of total processor power from liquid cooled servers.
InRackCDU™ -- For Liquid-cooled Data Centers
The Asetek lnRackCDU is a warm water CDU (Cooling Distribution Unit) system capable of removing up to 80kW of heat from the rack.
OnRackCDU™ -- For Liquid-cooled Data Centers
The Asetek OnRackCDU is a warm water system capable of reducing data center cooling cost by >50% and allowing 2.5x-5x increases in data center server density.
Asetek is the only liquid cooling solution validated and factory installed by Intel.
The Intel® Compute Modules for both Xeon® and Xeon® Phi™ CPUs, include:
Features Intel Xeon Scalable Processors with Asetek Direct-to-Chip (D2C) liquid-cooling
Features Intel Xeon Phi Processors with Liquid to Air Assisted (LAAC) technology
Our Direct-to-Chip (D2C) liquid cooling technology is cooling some of the fastest supercomputers in the world.
In fact, our technology is cooling three of the installations in the TOP20, including the fastest supercomputers in Taiwan and Japan.