The racks deployed for HPC and AI workloads have significantly higher power densities. Data centers around the globe are finding that liquid cooling is becoming a necessity as air is no longer a reliable solution.
Asetek liquid coolers are a drop-in replacement for air heat sinks within server nodes. Designed to fit within a 1U chassis, this allows for maximum densities at both the node and rack level. Asetek solutions are based on low pressure, redundant pumps and sealed liquid path cooling within each server node.
Our Direct-to-Chip (D2C) liquid cooling provides a distributed pumping architecture to address the full range of heat rejection scenarios in air- and liquid-cooled data centers. We offer a highly flexible, reliable and proven liquid cooling platform to efficiently cool the latest server designs and help users manage the transition from an air cooled to liquid cooled environment.
D2C Ingredient Coolers
Drop-in replacements for air heat sinks that transfer heat out of the server with liquidRead more
Rack level Liquid Assisted Air Cooled (LAAC) solution for air cooled data centersRead more
Rack level Direct-to-Chip (D2C) solution for liquid cooled data centersRead more
Our Direct-to-Chip (D2C) technology is cooling some of the fastest supercomputers in the world – including high profile GPU-enabled AI and HPC installations.