Maximum Computing Throughput

The racks deployed for HPC and AI workloads have significantly higher power densities. Data centers around the globe are finding that liquid cooling is becoming a necessity as air is no longer a reliable solution.

Increasing Density

Asetek liquid coolers are a drop-in replacement for air heat sinks within server nodes. Designed to fit within a 1U chassis, this allows for maximum densities at both the node and rack level. Asetek solutions are based on low pressure, redundant pumps and sealed liquid path cooling within each server node. 

Increasing Density

Liquid Cooling Technology for Data Centers

Our Direct-to-Chip (D2C) liquid cooling provides a distributed pumping architecture to address the full range of heat rejection scenarios in air- and liquid-cooled data centers. We offer a highly flexible, reliable and proven liquid cooling platform to efficiently cool the latest server designs and help users manage the transition from an air cooled to liquid cooled environment.

Flexible Platform for Both Air and Liquid Cooled Data Centers

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D2C Ingredient Coolers

Drop-in replacements for air heat sinks that transfer heat out of the server with liquid

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Rack level Liquid Assisted Air Cooled (LAAC) solution for air cooled data centers

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Rack level Direct-to-Chip (D2C) solution for liquid cooled data centers

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Proven Performance

Our Direct-to-Chip (D2C) technology is cooling some of the fastest supercomputers in the world – including high profile GPU-enabled AI and HPC installations.