News

Cybermedia Center, Osaka University Adopts Asetek Liquid Cooling for New Computer System “OCTOPUS”

Asetek (ASETEK.OL) and Cybermedia Center, Osaka University, today announced that Cybermedia Center, Osaka University will incorporate Asetek RackCDU Direct-to-Chip™ (D2C) liquid cooling for a new HPC (High Performance Computing) installation in Japan.

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Asetek Announces OEM Partnership with E4 Computer Engineering and Installation at CINECA in Italy

Asetek® (ASETEK.OL) today announced E4 Computer Engineering as a new data center OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C™ (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy

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Asetek Announces NEC Corporation as New Data Center OEM Partner

Asetek (ASETEK.OL) today announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip™ liquid cooling at a new HPC (High Performance Computing) installation in Japan.

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Asetek Announces New OEM, Channel Partner, and HPC Installation

Asetek today announced an order from a new channel partner to service demand from a new OEM customer for an undisclosed HPC (High Performance Computing) installation. All parties remain undisclosed at this time.

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Asetek Collaborates with Lenovo on Liquid Cooled Lenovo Legion Y920 Tower

Asetek® (ASETEK.OL) announced today that it is collaborating with Lenovo® to cool its new Lenovo Legion™ Y920 Tower. Designed for gamers, the new Lenovo Legion Y920 Tower offers everything you would expect from one of the world's top PC manufacturers, allowing gamers to test their abilities and not the limits of their rig.

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AMD Includes Asetek Liquid Cooling Retention Kits with Ryzen Threadripper CPUs

Asetek® (ASETEK.OL) today announced that retention kits for its desktop liquid coolers will be included with AMD’s new Ryzen Threadripper boxed processors.

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Asetek Receives Two Incremental Orders in Support of US Department of Energy Labs Cluster Installations

Asetek today announced two incremental orders from Penguin Computing, an established data center OEM. The orders are for Asetek’s RackCDU D2C™ (Direct-to-Chip) liquid cooling solution and will enable increased computing power for two currently undisclosed HPC sites at U.S. Department of Energy (DOE) National Laboratories.

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Asetek Announces New Regional OEM and New HPC installation

Asetek today announced an order from a new European OEM customer to service demand for an HPC (High Performance Computing) installation.

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Asetek receives incremental order for government contract

Asetek today announced an increase of its contract with the United States Department of Defense (DoD) Environmental Security Technology Certification Program (ESTCP).

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Asetek receives follow-on order from Penguin Computing

Asetek today announced a further order from Penguin Computing, an established data center OEM, for an undisclosed HPC (High Performance Computing) installation.

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