News

Asetek Wins Frost & Sullivan Award for Their Revolutionary Data Center Cooling Solution

Based on its recent analysis of the data center cooling solutions market, Frost & Sullivan recognizes Asetek® with the 2014 Global Frost & Sullivan Award for New Product Innovation Leadership. Asetek's RackCDU™ employs a warm water, server-level, direct-to-chip, liquid cooling system for servers. This ground-breaking solution reduces the energy required for the cooling of data center IT equipment by 60–80 percent and total data center energy consumption by 30 percent. In addition to the award, Frost & Sullivan has released their research report on Asetek’s RackCDU.

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Asetek Announces Largest Ever Design Win

Asetek® today announced that it has secured a design win with an undisclosed OEM customer for a graphics liquid cooling product. The ambitious project is forecasted by the customer to result in 2 – 4 million dollars of revenue. Shipping is scheduled to begin in the first half of 2015. The design win continues Asetek’s success in the growing graphics liquid cooling market.

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Asetek Allowed U.S. Patent Claims on Graphics Liquid Cooling

Asetek®, the world’s leading supplier of computer liquid cooling solutions, today announced that the U.S. Patent and Trademark Office (USPTO) has allowed a patent on the company’s thermal interposer liquid cooling system designed for cooling graphic processing units (GPUs). Liquid cooling the GPU enables lower noise, lower temperatures, and enhanced performance over traditional air cooling.

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Asetek Receives its Largest Order of RackCDU for US Federal Data Center

Asetek® announced today that it has received a purchase order for its RackCDU™ data center liquid cooling system placed by one of its Original Equipment Manufacturing (OEM) partners for immediate delivery. The order is the largest Asetek has received so far on its RackCDU products with a value of approximately $350,000, and includes liquid cooling for 29 racks.

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Asetek to Feature a Broad Range of HPC and Data Center Cooling Solutions at International Supercomputing Conference

Asetek® will highlight its RackCDU™ warm water liquid cooling solutions at the International Supercomputing Conference (ISC14) in Leipzig Germany
June 22–26, 2014. HPC (High Performance Computing) and Virtualization servers from a variety of manufactures will be on display with Asetek’s liquid cooling installed.

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Asetek Hot Water Data Center Cooling Solutions to be Featured at Datacenter Dynamics Converged

Asetek®, the winner of the Data Center Dynamics EMEA Award for Innovative Liquid Cooling, will showcase its data center liquid cooling RackCDU™ solutions at Datacenter Dynamics Converged at the Santa Clara Convention Center on June 17th 2014.

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Asetek Sees Continued Growth With Latest Workstation Design Win

Asetek® today announced that it has secured a design win with an undisclosed customer within the workstation market. The design win is a strategic one that sets the stage for future growth within this important market.

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Asetek Allowed U.S. Patent Claims on its RackCDU D2C™ Data Center Liquid Cooling

Asetek® today announced that the U.S. Patent and Trademark Office (USPTO) has issued a notice of allowance on the company’s patent claims on the groundbreaking RackCDU™ Direct-to-Chip liquid cooling technology for data centers.

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Asetek Receives Order of RackCDU Liquid Cooling System

Asetek® announced today that it has received a purchase order for its RackCDU™ data center liquid cooling system placed by one of its Original Equipment Manufacturing (OEM) partners. The order is a repeat order for use in a High Performance Computing (HPC) cluster at an undisclosed university.

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Asetek to Feature Hot Water Data Center Cooling Solutions at Datacenter Dynamics Converged

Asetek® will showcase its latest data center liquid cooling solutions at Datacenter Dynamics Converged in New York City at the New York Marriott Marquis on March 11th 2014. Asetek’s range of energy saving solutions includes RackCDU D2C™ (Direct-to-Chip) and RackCDU ISAC™ (In-Server Air Conditioning).

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