RackCDU D2C™ Order for New HPC Installation

Asetek today announced an order from one of its existing OEM partners for its RackCDU D2C™ (Direct-to-Chip) liquid cooling solution. The order is part of a new installation for an undisclosed HPC (High Performance Computing) customer.

“This repeat order confirms that we are on track to meet our ambition of increasing end-user adoption. The order is for an installation where our technology will be deployed for the first time and where we will provide not only CPU cooling but also GPGPU (General Purpose Graphic Processor Unit) cooling,”said André Sloth Eriksen, CEO and founder of Asetek.

The order will result in revenue to Asetek in the range of USD 125,000 with delivery in Q2 2017.

Read more about Asetek’s solutions for datacenter components such as GPGPU (General Purpose Graphic Processor Unit) on www.asetek.com/data-center/technology/data-center-components/