Premium Thermal AIO Solution, Acoustically Optimized
Asetek Emma V3 [Gen10] is engineered specifically for next-generation processors. It delivers lower core thermal resistance and enhanced installation flexibility, all within an ultra-quiet acoustic profile.
4mm Combined Offset: Precision Alignment with Core Hotspots
Compared to the previous generation, thermal resistance is reduced by an additional 1.5°C at typical TDP, optimizing heat transfer efficiency right at the source. This architecture is specifically tailored to tackle localized hot spots on the latest high-performance CPUs, such as the AMD Ryzen™ 9950X.
- Dual-Offset Design: Building upon the bracket offset concept from Emma V2, the Emma V3 further shifts the cold plate’s center groove closer to the heat source. Together, they achieve a combined offset of 4mm. Determined through extensive thermal simulations and real-world testing, this configuration ensures the coolant’s primary impingement zone directly covers the core hotspots.
- Optimized Convex Curvature: The copper cold plate features a redesigned convex curvature tailored to match the subtle surface curvature of next-gen CPU integrated heat spreaders (IHS). This maximizes the contact area with critical hot spots while remaining strictly within official mounting pressure specifications.
- High-Density Micro-Channels: Engineered with a high-density fin structure and paired with a high-efficiency hydraulic loop to significantly accelerate transient heat transfer.
Best-in-Class Balance of Performance and Acoustics
Controlling noise while elevating hydraulic efficiency remains a core challenge in liquid cooling engineering. The Emma V3 utilizes a high-head Closed Impeller architecture, achieving substantial acoustic improvements without sacrificing hydraulic performance.
- Operating at a full speed of 3,600 RPM (measured at a standard 25cm distance), the Emma V3 typically delivers up to 6 dB(A) lower acoustic levels compared to Emma V2 reference measurements. This reduction compared to its predecessor represents a massive drop in acoustic energy:
- Acoustic energy is reduced by approximately 4x, drastically minimizing the energy translated into system vibrations.
- Perceived loudness is cut by roughly 45%, transforming the pump’s acoustic profile from a noticeable hum into near-silent running.
Key enhancements of the Asetek Emma V3 include:
- 7-Blade Impeller: Utilizing an odd number of blades disrupts the acoustic phase alignment common in even-blade configurations within the pump cavity, effectively dispersing fluid impact energy.
- Optimized Tongue Clearance: Slightly increasing the gap between the outer diameter of the impeller and the stator housing tongue allows for a smoother fluid transition, minimizing impact noise.
- Relocated Injection Gate: Moving the manufacturing injection molding gate to the back of the impeller eliminates minor geometric tolerances that could cause unintended fluid disturbances.
- Monolithic Stator Housing: Integrating a multi-piece structure into a single component removes part-to-part joints, cutting off vibration propagation paths at the source.
Decoupled Alignment and Fluid Routing: Flexing True Thermal Potential
With AMD and Intel adopting vastly different architectural layouts for their latest processors—and with PC builders constantly pushing the envelope of chassis aesthetics—the directional alignment of the cold plate has become critical. For instance, the primary hotspot on the AMD Ryzen 9950X is positioned toward the lower edge (6 o’clock), while Intel platforms locate theirs toward the upper edge (12 o’clock).
- The Emma V3 introduces a new rotatable bracket design, completely decoupling the traditional fixed relationship between the tube outlets and the internal micro-channel orientation:
- Enhanced Factory Integration: This design allows the tube outlet orientation and the internal cold plate alignment to be configured independently during factory assembly. Based on specific system layouts or customer requirements, the tube routing can be optimized freely without compromising the precise targeting of platform-specific CPU hotspots (e.g., 6 o’clock for AMD, 12 o’clock for Intel).
- Streamlined SKU Management: A single pump architecture delivers optimal thermal performance across both major platforms, significantly enhancing product line planning flexibility and reducing SKU complexity for OEM and ODM partners.
(Optional Component for High-Load Environments)
Cross-flow Heat Exchanger (CCF Radiator): Designed for the extreme requirements of workstations and flagship gaming rigs, the optional CCF radiator optimizes heat exchange efficiency via perpendicular fluid and airflow directions. This configuration provides an additional 0.3 to 0.5°C temperature reduction over standard radiators.
Sustainability & Green Engineering
- Eco-Friendly, Rare-Earth-Free Pump Design: The electromagnetic drive system utilizes premium inert, corrosion-resistant magnets, completely eliminating the need for rare-earth elements. This significantly enhances long-term material stability while advancing global product sustainability.
- Food-Grade, Non-Toxic Patented Coolant: The internal coolant is engineered from eco-friendly, non-toxic materials that meet food-grade safety standards. It is completely safe to handle and can be disposed of through standard household wastewater systems. The formulation complies with the world’s most stringent environmental and chemical standards, carrying full certifications for RoHS, REACH, California Prop 65, and Halogen-Free compliance.
Quality Assurance & Engineering Excellence
- Rigorous Manufacturing & Validated Packaging: Every single radiator undergoes a comprehensive high-temperature flush and cleaning cycle during assembly, with full traceability implemented across the entire production process. Prior to mass production, the deployment packaging undergoes rigorous reliability validation via CNAS-certified stress testing, ensuring the product remains perfectly secure and leak-free against extreme temperature fluctuations and pressure shifts during global transit.
- 50,000-Hour Uncompromised Operational Lifespan: Engineered with an ultra-low fluid evaporation rate and an advanced anti-clogging, anti-freeze, and anti-corrosion formula, the platform guarantees at least 50,000 hours of peak operational life. Thermal dissipation efficiency remains uncompromised and will not degrade over years of sustained operation. Furthermore, the platform is fully verified under IEC 62368-1 and UL 62368-1 international safety standards, delivering the ultimate peace of mind and long-term reliability for end-users.
| Sockets Supported | Value |
| AMD Sockets Supported | AM4, AM5 |
| Intel Sockets Supported | LGA 1700, LGA 1851, LGA 1954 |
| Heat Exchanger | Value |
| Core Dimensions | 360 mm: 120 x 360 x 30 mm |
