News


Asetek Receives Order from Fujitsu to Cool Japan's Fastest AI Supercomputer System

Asetek today announced a new order from existing OEM partner Fujitsu for the National Institute of Advanced Industrial Science and Technology (AIST). The order for Asetek RackCDU D2C™ (Direct-to-Chip) liquid cooling will be used at the AI Bridging Cloud Infrastructure (ABCI) cluster, set to become the fastest supercomputer system in Japan.

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Asetek to Showcase its Data Center Liquid Cooling Technology at SC17

Asetek® (ASETEK.OL) today announced it will showcase HPC Liquid Cooling solutions at SC17 in Denver, Colorado November 13-16.

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Asetek Announces Acer as New Data Center OEM Partner

Asetek® today announced Acer as a new data center OEM partner. Acer will incorporate Asetek liquid cooling technology into its Altos dual Skylake high performance servers (W2200h-W670h F4). Asetek will be displaying an example of an Acer server with liquid cooling at its booth (#1

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Cybermedia Center, Osaka University Adopts Asetek Liquid Cooling for New Computer System “OCTOPUS”

Asetek (ASETEK.OL) and Cybermedia Center, Osaka University, today announced that Cybermedia Center, Osaka University will incorporate Asetek RackCDU Direct-to-Chip™ (D2C) liquid cooling for a new HPC (High Performance Computing) installation in Japan.

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Asetek Announces OEM Partnership with E4 Computer Engineering and Installation at CINECA in Italy

Asetek® (ASETEK.OL) today announced E4 Computer Engineering as a new data center OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C™ (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy

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Asetek Announces NEC Corporation as New Data Center OEM Partner

Asetek (ASETEK.OL) today announced NEC Corporation as a new data center OEM partner. NEC Corporation, through its subsidiary NEC Fielding, Ltd., will deploy Asetek RackCDU Direct-to-Chip™ liquid cooling at a new HPC (High Performance Computing) installation in Japan.

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Asetek Announces New OEM, Channel Partner, and HPC Installation

Asetek today announced an order from a new channel partner to service demand from a new OEM customer for an undisclosed HPC (High Performance Computing) installation. All parties remain undisclosed at this time.

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Asetek Collaborates with Lenovo on Liquid Cooled Lenovo Legion Y920 Tower

Asetek® (ASETEK.OL) announced today that it is collaborating with Lenovo® to cool its new Lenovo Legion™ Y920 Tower. Designed for gamers, the new Lenovo Legion Y920 Tower offers everything you would expect from one of the world's top PC manufacturers, allowing gamers to test their abilities and not the limits of their rig.

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AMD Includes Asetek Liquid Cooling Retention Kits with Ryzen Threadripper CPUs

Asetek® (ASETEK.OL) today announced that retention kits for its desktop liquid coolers will be included with AMD’s new Ryzen Threadripper boxed processors.

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Asetek Receives Two Incremental Orders in Support of US Department of Energy Labs Cluster Installations

Asetek today announced two incremental orders from Penguin Computing, an established data center OEM. The orders are for Asetek’s RackCDU D2C™ (Direct-to-Chip) liquid cooling solution and will enable increased computing power for two currently undisclosed HPC sites at U.S. Department of Energy (DOE) National Laboratories.

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