AI and HPC

Artificial Intelligence (AI) is transforming HPC by enabling users to gain key insights from massive amounts of data that were previously unmanageable. Given the critical research these systems are tasked to perform, these high-density clusters are expected to run at 100% utilization for sustained periods, making cooling performance even more critical. 

Higher Rack Level Densities

Cutting edge AI and HPC requires the highest performance versions of the latest CPUs and GPUs – such as NVIDIA’s V100 GPUs and Intel’s Xeon Scalable Processors. These chip wattages translate into substantially higher wattage densities at both the node-level and rack-level because of the component wattages and the requirement for the shortest possible signal distance between processors, GPUs, switches both in and between cluster racks.


Higher Rack Level Densities

Asetek Solutions for AI and HPC

Intel Buchanan Pass cooler

D2C Ingredient Coolers

Drop-in replacements for air heat sinks that transfer heat out of the server with liquid

Asetek Inracklaac Simplified Front 3K width


Rack level Liquid Assisted Air Cooled (LAAC) solution for air cooled data centers

Asetek Pack N Go G 3K Full V1 (1)


Rack level direct to chip (D2C) solution for liquid cooled data centers