Cutting edge AI and HPC clusters require not only the highest performing versions of the latest CPU and GPU offerings from Intel, AMD and NVIDIA, but all packaged in dense configurations. This translates into substantially higher wattage densities at both the node and the rack level. Data centers around the globe are finding that liquid cooling is becoming a necessity as air is no longer a reliable solution. Asetek's data center technologies bring advances in performance and increased densities.
Air heat sinks struggle to handle the heat to maintain maximum throughput. Reducing rack densities results in greater latency and lower overall throughput.
Liquid enables efficient cooling of high-wattage CPUs, GPUs and memory without sacrificing density for performance. Liquid cooling also improves reliability and allows for future proofing of racks for even high kW servers and blades.
Asetek liquid coolers are a drop-in replacement for air heat sinks within server nodes. Designed to fit within a 1U chassis, this allows for maximum densities at both the node-level and rack-level to minimize the interconnect distance between the servers both in and between the racks.
Our solutions are based on low pressure, redundant pumps and sealed liquid path cooling within each server node.
Asetek Direct-to-Chip (D2C) liquid cooling solution increases power density and high wattage processing for HPC and AI in Data Centers. Benefits of deployment of Asetek D2C liquid cooling solutions include density optimization, energy efficiency, improved power usage effectiveness (PUE), and OpEx savings, while also enabling the greening of data centers through waste heat recovery and re-use.
Unleash Server Performance Potential
- Optimize compute with Asetek D2C LC technology
- Run the hottest and fastest processors.
- Maximum sustained CPU throughput and prevent throttling.
- Improve reliability and increase uptime.
Shift CapEx to Compute
- Power: Grow DC server count within current power envelope.
- Space: Increase server count within existing racks.
- Cooling: Purchase inexpensive dry coolers rather than chillers.
- Utilize power efficient cooling to eliminate chillers and cooling towers
- Reduce server power by eliminating fans
- System Level Design and Support for Maximum Performance and Reliability
When defining our liquid cooling platforms, Asetek qualifies all materials for compatibility while ensuring proper chemical balances within the system.
- Distributed Pumping Advantages
Compared to centralized pumping, Asetek D2C solutions enable distributed pumping renowned for being extremely reliable, given benefits of constant immersion in fluid.
Liquid cooling enables extreme high performance computing (HPC) with dramatic energy savings. Asetek's liquid cooling technology provides an energy efficient alternative to air-cooled data centers. Asetek's patented technology can reduce the energy data centers use for cooling by up to 50%. This is done by cooling the processors directly instead of cooling the entire rack.
- Reduces data center energy usage for cooling by up to 50% over traditional air-cooling
- Lowers processor temps, resulting in 4% reduction in solution times
- Minimizes latency by maximizing cluster interconnect density
Waste Heat Recovery
Asetek technology is enabling the greening of data centers through waste heat recovery and re-use for things like district heating networks.
With Asetek technology, Data Center operators are in control and can adjust outlet temperatures independent from the water in the racks and adjust the pump speed, to maintain consistent return temperatures.
In addition, the energy spent cooling can be recouped and for example provide 60°C water for remote heating or turn the waste hot water into electricity.
Our Direct-to-Chip (D2C) liquid cooling provides a distributed pumping architecture to address the full range of heat rejection scenarios in air- and liquid-cooled data centers. We offer a highly flexible, reliable and proven liquid cooling platform to efficiently cool the latest server designs and help users manage the transition from an air cooled to liquid cooled environment.
The Asetek lnRackCDU is a genuinely low pressure, warm water CDU (Cooling Distribution Unit) system capable of removing up to 80kW of heat from the rack.
Direct to Chip (D2C) liquid cooling technology dramatically increases data center density and enables maximum sustained CPU throughput.
D2C liquid cooling provides a distributed cooling architecture to address the full range of heat rejection scenarios in air-cooled and liquid-cooled data centers.
Density and interconnect optimization is key to obtaining the computational power needed for AI and HPC. With applications emerging to solve a range of challenges, these systems can have a diverse set of requirements when considering thermal solutions.
AI & HPC
Artificial intelligence (AI) is transforming HPC. Given the critical research these systems are tasked to perform, these high density clusters are expected to run at 100% utilization for sustained periods, making cooling performance even more crucial.
With more HPC-style server configurations moving into traditional air-cooled data centers, data center operators must grapple with not only the increased power densities but also the thermal challenges they present.
Our Direct-to-Chip (D2C) technology is cooling some of the fastest supercomputers in the world – including high profile GPU-enabled AI and HPC installations.